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Applications being accepted for TechCon Innovation Marketplace

Are you a student or young innovator with a novel technology, product, service, or research project that could transform global development?

Participate in the TechCon Innovation Marketplace for a chance to win financial and mentorship support for your project!

Screen Shot 2016-05-26 at 12.45.21 PMThe Innovation Marketplace, hosted by USAID and MIT, is a competition showcasing the talent of students and young innovators (age 18 – 30) who are using science, technology, innovation and partnerships to tackle global challenges.

The Innovation Marketplace will take place in mid-November on MIT’s campus, which is located in the Boston area, as a feature of HESN’s TechCon 2016. Throughout the course of the competition, individuals or teams of young innovators such as students, young professionals, or postdoctoral researchers will have the opportunity to gain exposure, build support for their innovative product or research, receive technical feedback, and practice their pitching skills. All accepted applicants will be invited to attend TechCon, and the final round of winners from each category will receive financial and/or mentorship support.

Ready to submit your innovation? Read the guidelines and get started on your application today! All applications are due by May 31.

Please direct your questions to techcon@usaid.gov. Note that USAID cannot cover travel expenses for participants at this time.

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